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Back to homepageHilton Malaysia and Malaysia Airlines Team Up to Offer Travelers a Culinary Adventure During Raya
Hilton Malaysia brings signature dishes to the Golden Lounge KUALA LUMPUR, Malaysia, April 20, 2023 /PRNewswire/ — Hilton Hotels Malaysia is excited to announce a special Raya collaboration with Malaysia Airlines’ Golden Lounges in KL International Airport from 20 April
Read MoreKynix will attend PCIM Europe 2023 from May 9th to 11th
SHENZHEN, China, April 20, 2023 /PRNewswire/ — Kynix Semiconductor Limited, a professional independent distributor of electronic components, recently announced that it would attend PCIM Europe. The exhibition will be held at Nuremberg Exhibition Center in Germany from Tuesday, May 9th to
Read MoreAstronergy 355MW TOPCon Modules to Offer Green Energy in Australia
HANGZHOU, China, April 20, 2023 /PRNewswire/ — ASTRO N – Astronergy’s n-type TOPCon module series – recently saw great moves at the Walla Walla Solar Farm in Australia, laying a milestone for marking Astronergy TOPCon PV modules’ fastened pace to
Read MoreA World-First for the World’s Number One Cookie*: OREO Café opens in Qatar
DOHA, Qatar, April 20, 2023 /PRNewswire/ — The world’s number one cookie has landed at Doha’s Hamad International Airport (HIA), with the opening of the first permanent OREO Café outside of the USA and first in an airport. OREO Day
Read MoreSenseAuto Empowers Nearly 30 Mass-produced Models Exhibited at Auto Shanghai 2023 and Unveils Six Intelligent Cabin Products
SHANGHAI, April 20, 2023 /PRNewswire/ — The Shanghai International Automobile Industry Exhibition (“Auto Shanghai 2023”), themed “Embracing the New Era of the Automotive Industry,” has been held with a focus on the innovative changes in the automotive industry brought about
Read MoreSK hynix Develops Industry’s First 12-Layer HBM3, Provides Samples To Customers
Develops HBM3 product with industry’s largest 24GB memory capacity; customers’ performance evaluation of samples underway Features high-capacity and high-performance through stacking of 12 DRAM chips Plans to complete preparation for mass production by first half of 2023, aimed at solidifying
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